PG-EAM - Graduate Program in Aeronautical and Mechanical Engineering
PT EN
Article 2001

Ultrathin silicon-compound barrier coatings for polymeric packaging materials: An industrial perspective

Authors

Czeremuszkin, G.
Latrèche, M.
Wertheimer, M. R.

Plasmas and Polymers , vol. 6 , no. 1-2 , pp. 107-120

ISSN: 10840184

87
Citations
4
Authors

Abstract

Growing demands for increased shelf-life of food products and chemical inertia of the contact surfaces have stimulated development of polymers with improved high-barrier properties. Our objectives in this article are (1) to describe experimental results on Plasma-enhanced chemical vapor deposition (PECVD) and its importance to produce thin layers of inorganic glassy barrier materials for food, pharmaceutical, and organic display applications; (2) despite the thereby greatly enhanced quality of film or rigid packaging material, some residual coating defects result in less-than-perfect gas, moisture and aroma barriers: an innovative technique based on reactive ion etching (RIE) in oxygen plasma is also presented, along with a staining method, which render even sub-μm coating defects visible. Data are shown for oxygen transmission rate on virgin and defective coatings, and the industrial context and applications are presented.

Keywords

Gas barrier Packaging PECVD Plastics Silicon dioxide

Chemical Engineering (miscellaneous) (CENG) Physics and Astronomy (all) (PHYS) Polymers and Plastics (MATE)
: Scopus
Last Update: 2026-06-25
: 2-s2.0-0035384331