PG-EAM - Graduate Program in Aeronautical and Mechanical Engineering
PT EN
Article 2020

Aeroelastic behavior of a composite plate-like wing under piezoelectrically induced stresses

Authors

Versiani, Thiago de Souza Siqueira
Tsunematsu, Douglas Quintanilha
Silvestre, Flávio José
Guimarães, Alessandro

Mechanical Systems and Signal Processing , vol. 143 , Article 106795

ISSN: 08883270

12
Citations
6
Authors

Abstract

© 2020 Elsevier LtdRecent aircraft are increasingly presenting unconventional wing configurations, resulting in unusual aeroelastic responses and consequently giving rise to different technological strategies to enhance aeroelastic stability. Among them, the technique of stress stiffening by piezoelectric actuation emerged as a promising technological solution to improve the aeroelastic stability of structures with both ends axially constrained. Therefore, an aeroelastic model employing smart composite beam elements and time domain aerodynamic loads with strip theory for stress stiffening aeroelastic problems was developed and carefully validated. In addition, the effect of bending-torsion coupling provided by concentrated masses on the aeroelastic response of the structure is also taken into account, which was included by the presence of a slender ballast arbitrarily positioned along the span and chord. Parametric studies were performed investigating the influence of aspect ratio, fiber orientation angle, ballast position, as well as piezoelectric unit position along the span and its input voltage. Results showed a promising performance of such technique, as it could increase the bandwidth of two flexible modes associated with the flutter mechanism.

Keywords

Aeroelastic stability Composite structures Finite elements Piezoelectric transducers Stress stiffening

Control and Systems Engineering (ENGI) Signal Processing (COMP) Civil and Structural Engineering (ENGI) Aerospace Engineering (ENGI) Mechanical Engineering (ENGI) Computer Science Applications (COMP)
: Scopus
Last Update: 2026-06-25
: 2-s2.0-85082450269
PII: S0888327020301813