PG-EAM - Graduate Program in Aeronautical and Mechanical Engineering
PT EN
Article 2023

Analytical solution of two-dimensional unsteady heat conduction in multi-layered cylindrical sectors applied to thermal plug and abandonment of oil wells

Authors

De Andrade, Gabriel S.
Nascimento, Ernandes J.G.

International Journal of Thermal Sciences , vol. 188 , Article 108180

ISSN: 12900729

19
Citations
3
Authors

Abstract

© 2023 Elsevier Masson SASIn this work, a hybrid analytical and numerical solution for transient heat conduction across a composite cylindrical sector is presented. A two-dimensional domain consisting of a multi-layer circular sector of angle φ was investigated (φ<2π). The Separation of Variables Method (SVM) was applied to solve the partial differential equation with non-homogeneous boundary conditions of the first, second and third kinds prescribed in the radial direction. Homogeneous boundary conditions of first and second kinds were arbitrated in the angular direction. A spatial time-independent source term gi(r,θ) was considered. The radial eigenvalues problem for the (r,θ) domain returns only real quantities and depends implicitly on the angular eigenvalues. Results for time dependent temperatures using the Separation of Variables Method were compared with numerical results, showing good accuracy. A second set of results was developed to investigate boundary conditions, material properties and the thermal source power required to rise temperature levels (mainly around the mid-angle φ/2) high enough to promote melting of certain layers of materials. These results might be useful for investigating a novel technology for the decommissioning of oil wells using thermal sources, often referred to in the literature as Thermal Plug and Abandonment (TP&A).

Keywords

Composite cylinder domain Hybrid analytical/numerical solution Plug and abandonment Polar coordinates Separation of variables method Transient heat conduction

Condensed Matter Physics (PHYS) Engineering (all) (ENGI)
: Scopus
Last Update: 2026-06-25
: 2-s2.0-85147983581
PII: S1290072923000418