PG-EAM - Programa de Pós-Graduação em Engenharia Aeronáutica e Mecânica
EN PT
Artigo 2001

Ultrathin silicon-compound barrier coatings for polymeric packaging materials: An industrial perspective

Autores

Czeremuszkin, G.
Latrèche, M.
Wertheimer, M. R.

Plasmas and Polymers , vol. 6 , no. 1-2 , pp. 107-120

ISSN: 10840184

87
Citações
4
Autores

Resumo

Growing demands for increased shelf-life of food products and chemical inertia of the contact surfaces have stimulated development of polymers with improved high-barrier properties. Our objectives in this article are (1) to describe experimental results on Plasma-enhanced chemical vapor deposition (PECVD) and its importance to produce thin layers of inorganic glassy barrier materials for food, pharmaceutical, and organic display applications; (2) despite the thereby greatly enhanced quality of film or rigid packaging material, some residual coating defects result in less-than-perfect gas, moisture and aroma barriers: an innovative technique based on reactive ion etching (RIE) in oxygen plasma is also presented, along with a staining method, which render even sub-μm coating defects visible. Data are shown for oxygen transmission rate on virgin and defective coatings, and the industrial context and applications are presented.

Palavras-chave

Gas barrier Packaging PECVD Plastics Silicon dioxide

Chemical Engineering (miscellaneous) (CENG) Physics and Astronomy (all) (PHYS) Polymers and Plastics (MATE)
: Scopus
Última atualização: 2026-06-25
: 2-s2.0-0035384331