PG-EAM - Programa de Pós-Graduação em Engenharia Aeronáutica e Mecânica
EN PT
Artigo 2017

Aeroelastic behavior of stiffened composite laminated panel with embedded SMA wire using the hierarchical Rayleigh–Ritz method

Autores

de Matos Junior, Odeny D.
Castro, Saullo G.P.

Composite Structures , vol. 181 , pp. 26-45

ISSN: 02638223

26
Citações
3
Autores

Resumo

© 2017 Elsevier LtdThis work investigates the effects of temperature in the shape memory alloy hybrid composites (SMAHC) cylindrical stiffened panels’ aeroelastic stability. The SMAHC is modelled using a micromechanical formulation embedding carbon fiber, SMA wire and resin to the same lamina and taking into account the martensite/austenite phases of transformation in the material response. Virtual work principle formulation is implemented with classical laminate plate theory (CLPT) panel formulation and one-dimensional Euler-Bernoulli beam theory formulation for the stiffener. Numerical results are obtained by using an energy based semi-analytical method applying hierarchical polynomials to approximate the membrane and out of plane displacement fields. Different geometric configurations, laminate stacking sequences, boundary conditions and radii of curvature are investigated. The study shows that the variation of temperature induce stiffening due to changes in the martensite/austenite fractions of the SMA, increasing the critical flutter dynamic pressure. Therefore, it can be achieved certain control in the flutter critical boundary by increasing the temperature of the shape memory alloy (SMA) wire. The effects due to the SMA wire stiffening with the temperature are more pronounced for cross-ply stiffened cylindrical panels with unitary aspect ratio and for angle-ply panels with aspect ratio higher than one.

Palavras-chave

Flutter Hierarchical finite element method Shape memory alloy Stiffened cylindrical composite panel

Ceramics and Composites (MATE) Civil and Structural Engineering (ENGI)
: Scopus
Última atualização: 2026-06-25
: 2-s2.0-85028415617
PII: S0263822317311807